北京大学 | 2018年7月9日-20日

 

2018年北京大学“硅基光电子技术及应用”暑期学校

    2018年暑期学校授课老师(按课程先后排序)

  • Zhiping Zhou

    Peking University

    Biography:

    Zhiping (James) Zhou received his Ph.D. (EE) degree from Georgia Institute of Technology (GT), USA, in 1993. From 1993 to 2005, he was with the Microelectronics Research Center at GT, where he engaged research and development in the areas of nanotechnology; nanophotonic devices and sensors; ultra-fast optical communications; integrated optoelectronics; semiconductor devices and sensors; and vector rigorous diffraction analysis. He is now a “Changjiang” Professor at Peking University, Beijing, China, focusing on silicon photonics and microsystems research and development. He has been credited for over 400 technical papers and presentations. He is a Fellow of OSA, SPIE, and IET. He serves as Director of Chinese Optical Society (COS) and Chinese Society for Optical Engineering (CSOE), the funding Editor-in-Chief of Photonics Research, and is on OSA Board of Editors. He was funding Chair of IEEE Wuhan Section, 2007-2008, Director of IEEE Atlanta Section, 2001- 2003. He also chaired, co-chaired, and served on many program committees for various conferences for IEEE Photonics Society, OSA, SPIE, COS, and CSOE.

    Title: Silicon Photonics and Its Applications

    Abstract: Silicon Photonics has demonstrated itself as a more efficient and lower cost on-chip optical solution for high speed optical communications, datacenter interconnections, and sensing technology. It is expected that a successful monolithic integration of silicon based photonic devices and microelectronic devices will lead to a significant "micro optoelectronics revolution". This lecture will start with an introduction to Silicon Photonics and its short history. After a brief description of the fundamental theories, the recent progress, potential applications and a future outlook will be discussed and presented.

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    Wei Shi

    Laval University

    Biography:

    Wei Shi is an Associate Professor in the Department of Electrical and Computer Engineering and a faculty member of the Center of Optics, Photonics, and Lasers (COPL), Université Laval, Québec, QC, Canada. He received the Ph.D. degree in electrical and computer engineering from the University of British Columbia, Vancouver, BC, Canada, in 2012, where he was awarded the BCIC Innovation Scholarship for a collaboration entrepreneurship initiative. Before joining Université Laval in 2013, he was a researcher at McGill University, Montreal, QC, Canada, where he held a Postdoctoral Fellowship from the Natural Sciences and Engineering Research Council of Canada (NSERC). His current research focuses on integrated photonic devices and systems, involving silicon photonics, nanophotonics, CMOS-photonics co-design, high-speed optical communications, chip-scale lasers, and optical sensors. His group has achieved the first demonstrations of a femtojoule microring modulator reaching 80 Gb/s and an integrated flexible-grid WDM transmitter with an optical frequency comb. More recently, they achieved a record performance of coherent transmission using all-silicon optical modulators. In addition, he is a recognized expert in silicon nanophotonic Bragg-grating devices such as integrated WDM filters. He has over 100 journal and conference publications and two book chapters. As per Google Scholar, his h-index is 21 with over 1,300 citations. He currently directs an NSERC Strategic Partnership Grants (SPG) project on hybrid photonic integration and an NSERC Collaboration Research and Development Grants (CRD) project on high-speed silicon photonic transmitters for advanced modulation formats.

    Title: Silicon photonic modulators for high-capacity optical transmissions

    Abstract: This tutorial presents the fundamentals and design of silicon photonic modulators and their applications for high-speed interconnects and advanced modulation formats such as pulse-amplitude modulation and quadrature amplitude modulation. Recent progress in low-power silicon photonic transmitters and CMOS-photonics co-design will be reviewed.

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    Daoxin Dai

    Zhejiang University

    Biography:

    Daoxin Dai received the B.Eng. degree from the Department of Optical Engineering, Zhejiang University (ZJU), Hangzhou, China, and the Ph.D. degree from the Royal Institute of Technology, Stockholm, Sweden, in 2000 and 2005, respectively. He joined ZJU as an Assistant Professor in 2005 and became an Associate Professor in 2007, and a Full Professor in 2011. He visited the Chinese University of Hong Kong in 2005, and Inha University, South Korea, in 2007. He was with the University of California, Santa Barbara, USA, as a Visiting Scholar in the years of 2008-2011. He is currently leading the Silicon Integrated Nanophotonics Group at Zhejiang University and he has published ~170 refereed international journal papers. Dr. Dai is one of Most Cited Chinese Researchers in 2015-2018 (Elsevier). He has given ~70 invited talks and served as the TPC Member or Session Chair for prestigious international conferences (e.g., OFC). He is also serving as the Associate Editor of the Journals of IEEE Photonics Technology Letters, Optical and Quantum Electronics, and Photonics Research. He is the Guest Editor of the Integrated Photonics special issue of Photonics Research, and the Metamaterials Photonics and Integration special issue of IEEE JSTQE.

    Title: Silicon photonic devices for multiplexing and switching

    Abstract: This talk discusses recent progresses in silicon nanophotonic integrated devices for multiplexing and switching, which are key elements in a multi-channel multiplexed photonic networks-on-chip. On-chip (de)multiplexers include wavelength- division-multiplexing filters based on arrayed-waveguide gratings and microring resonators, polarization-division-multiplexing devices like polarizers, polarization-beam splitters and polarization rotators, mode-division-multiplexing devices, and some novel hybrid (de)multiplexers enabling more than one multiplexing technologies simultaneously. Thermal- switchable silicon photonic devices are also discussed regarding the increasing demands for reconfigurable photonic networks- on-chip, including high-performance optical switches and reconfigurable add-drop multiplexers.

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    Rajeev J. Ram

    MIT

     
    Biography
     

    Rajeev J. Ram has worked in the areas of physical optics and electronics for much of his career. In the early 1990’s while a graduate student at UCSB, he developed the III-V wafer bonding technology that led to record brightness light emitting devices at Hewlett-Packard Laboratory (Lumileds) in Palo Alto. While at HP Labs, he participated on the first commercial deployment of vertical cavity surface emitting lasers. In the early 1990′s, he developed semiconductor lasers without population inversion, semiconductor lasers that employ condensation of massive particles (polariton lasers), and threshold-less lasers. Since 1997, Ram has been on the Electrical Engineering and Computer Science faculty at the Massachusetts Institute of Technology (MIT) and a member of the Research Laboratory of Electronics. He has served on the Defense Sciences Research Council advising DARPA on new areas for investment and served as a Program Director at the newly founded Advanced Research Project Agency-Energy. His group at MIT has developed energy-efficient photonics for microprocessor systems, microfluidic systems for the control of cellular metabolism, and the first light-source with greater than 100% electrical-to-optical conversion efficiency. He is a MacVicar Faculty Fellow, a Bose Research Fellow at MIT, and a Fellow of the Optical Society of America and IEEE Fellow.

    Title: The Integration of Photonics and CMOS Electronics

    Abstract: Integration of photonics with advanced electronics leverages transistor performance, process fidelity and package integration, to enable a new class of systems-on-a-chip for a variety of applications ranging from computing and communications to sensing and imaging. Monolithic silicon photonics is a promising solution to meet the energy efficiency, sensitivity, and cost requirements of these applications. In this tutorial, I will discuss the specific design considerations for the integration of photonic components with CMOS microelectronics. We will explore "zero-change" CMOS photonics where all photonic functions (WDM, high-speed detectors and modulators) are realized using only the material and mask layers that are used for CMOS microelectronics. I will discuss specific manufacturing and design rule constraints imposed by high-yield, high-performance CMOS manufacturing and the photonic design approaches that we have demonstrated. In this way, we are able to demonstrate systems with over 70M components. monolithically integrated together. This CMOS photonics approach can be extended to advanced CMOS technologies such as FinFETs and Ultrathin body SOI by introducing minimal process modifications. We will explore such "min-change" CMOS photonics as a platform for ubiquitous photonic functionality at any CMOS technology scale. Together these platforms illustrate integrated system applications beyond the Moore-scaling, while being able to offload major communication tasks without complicated 3D integration approaches.

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    Peter De Dobbelaere

    Luxtera

     

    Biography:

    From 1991 to 1995 he was employed by IMEC, Belgium working on various projects including short reach optical interconnect and heterogeneous integration of III-V lasers with Si and polymer waveguides. From 1995 to 1999, he was with Akzo-Nobel N.V., The Netherlands and U.S., where he was engaged in product development and reliability of polymer-based thermo-optic waveguide switch devices. In 1999, he joined OMM Inc., San Diego, CA, where he was responsible for product and technology development of MEMS-based optical switches. His latest position there was CTO and Director of Product Engineering and Reliability. In 2004, he joined Luxtera, Inc., Carlsbad, CA, where he is currently responsible for technology development for silicon photonics. Peter received his Ph.D. in Integrated Optics from the University of Gent, Belgium.

    Title: Photonics for high speed interconnect

    Abstract: We will start by highlighting the need for high speed interconnect and the solutions that optical communications offer. This will be followed by an overview of photonic technologies that have been used over the years. This will be followed by an extensive section on silicon photonics: what are the drivers, the challenges and technology results by various groups. We will show examples of actual products. Finally we will conclude with an outlook over future implementations.

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    Yasuhiko Arakawa

    The University of Tokyo

     

     

    Biography:

    Yasuhiko Arakawa received his PhD degree in Electronics and Electrical Engineering from the University of Tokyo in 1980. He joined the University of Tokyo as an assistant professor and became a full professor at the University of Tokyo in 1993. He was the director of the Institute for Nano Quantum Information Electronics (Nano Quine) at the University of Tokyo from 2006 to 2018 and is now a specially-appointed Professor of the Nano Quine. He served tothe International Commission for Optics (ICO) as the President from 2014 to 2017. Since 2017, he has beena Foreign Member of US National Academy of Engineering (NAE).
    He has received several awards, includingLeo Esaki Award (2004), IEEE/LEOS William Streifer Award (2006), Fujiwara Award (2007), IEEE David Sarnoff Award (2009), Medal with Purple Ribbon (2009), C&C Prize (2010), Heinrich Welker Award (2011), OSA Nick Holonyak Jr. Award (2011), and Japan Academy Prize (2017). He is a Life Fellow of IEEE and a Fellow of OSA.

    Title: Quantum Dots for Advanced Nano-Optoelectronics

    Abstract: Since the first proposal of the concept of the quantum dot in 1982, the quantum dots have been intensively studied for both fundamental solid-state physics and advanced device applications. Fully discretizing the energy levels of electrons by quantum dots has enabled the realization of high performance quantum lasers, high-sensitivity quantum dot infrared detectors, and quantum information devices such as single photon sources. Quantum dots can be applied to solar cells with a forecasted conversion efficiency over 75% for the future sustainable renewable energy system. Moreover, embedding a single quantum dot inside the photonic crystal nanocavity provides a new platform for studying solid-state cavity quantum electronics (cavity-QED).
    In this lecture, we address recent progress in quantum dot technology, including practical implementation of quantum dot lasers and demonstration of single photon sources operating above room temperature. Moreover, advances in quantum dot cavity-QED andfuture outlook of quantum dot nano-optoelectronics are also discussed.

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    Ignazio Piacentini

    ficonTEC

      Biography:

    Ignazio Piacentini took up the position of Director of Business Development at ficonTEC Service GmbH in Achim, Germany in August 2015, after previously heading the Photonics Devices Assembly Business Unit at PI miCos GmbH (PhysikInstrumente Group).
    Before relocating to Germany, he directed ImagingLab Srl, in Lodi (Italy) an engineering/consulting company specialized in machine vision and advanced robotics. He also held the position of Business Development Manager Europe for imaging and motion of National Instruments (Austin, TX) from 1999 to 2003.
    During this time he also served two 3-year mandates as a member of the Board of Directors of EMVA (European Machine Vision Association). Before joining the machine vision industry in the early ‘90’s, he has spent many years working for the European Commission (Euratom) designing control and data acquisition systems for large-scale thermonuclear fusion experimental projects, including a long spell at the JET Joint Undertaking (Culham Labs, UK).
    He has a B.Sc. in Nuclear Engineering (Milan, Italy, 1975) and a M.Sc. degree in Digital Systems and Instrumentation (Polytechnic of Central London, UK, 1987).

    Title 1: Lowering the cost of Photonics Integrated Chips assembly via advanced automation

    Abstract: Comparing the cost of packaging of conventional CMOS chips with that of PICs, we will discover a staggering difference: 10-12 % for the former and rising up to 80% for the latter. How PICs production numbers will escalate is a hotly debated topic, but whenever that will happen, advanced automation in assembly and testing will play a major role in keeping the cost at bay. Ensuring high yields on manual assembly line is a difficult task, while automated processes can also provide data relevant to production quality, grading of the devices, and actual yields.
    The lecture will continue on what was presented at PKU in 2016, moving from the state of the art of current machines to the requirementsof high-volume manufacturing. An introduction to the main assembly steps and the major ‘ingredients’ of a typical machine will also be given, with some background of the major technologies such as motion control, machine vision, instrumentation and application software.

    Title 2: Testing as part of the manufacturing chain: photonics wafers, singulated chips, and fully packaged devices

    Abstract: Automated packaging and assembly has amply discussed and presented. Testing however, would also deserve some more discussion, differentiating between wafer level, singulated chips, and fully integrated devices. PIC testing requires both electrical probing (limited to DC and low frequency, or extending to RF) and optical probing, with very different accuracy requirements. Optical probing presents different challenges whether is targeting top grating structures or edge coupling. The lecture will cover and illustrate a full array of issues, from mechanical high accuracy positioning, to probing heads and modular optical instrumentation.

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    Ruping Cao

    Luceda

     

    Biography:

    Dr. Ruping Cao, application engineer and Asia business development manager at Luceda Photonics. She is helping integrated photonic designers to implement proper design automation solutions to achieve efficient, scalable, and extensible design flow. She gets her PhDfrom Lyon Institute of Nanotechnologies (École Centrale de Lyon), and Mentor Graphics Corp., France.

    Terence Chen

    Luceda

     

    Biography:

    Terence Chen is the Worldwide Foundry Alliance Manager of IC Design Solutions Division of Mentor, A Siemens Business since 2011. Terence started his career as a process integration engineer in TSMC in 2000.
    With over 18 years of experience in the semiconductorindustries, Terence is devoted to enabling IoT and Si Photonics foundries ecosystem, strategic partnerships, and customer engagement.
    Terence holds a M.S. in Electrical Engineering and an EMBA for business strategic alliance from National Tsing Hua University in 1998 and 2017, respectively. Terence is the lead author on 21 issued patents for semiconductor devices.

    Guowei Cao

    Luceda

     

    Biography:

    Dr. Guowei Cao, senior engineer at Research Institute of Optoelectronics Integration, 38th Research Institute, China Electronics Technology Group Corporation.
    In 2012, he obtained the doctor of science degree from the Department of Optics and Optical Engineering at the University of Science and Technology of China. In the same year, he entered Research Institute of Optoelectronics Integration, 38th Research Institute. The main research subject is the automated design of silicon photonics devices. He is currently responsible for the development of the PDK for the silicon photonics platform, Multi-project waferservice technical support work.

    Title: Quickly create your first silicon photonics chip design: Hands-on course of silicon photonics design based on IPKISS and Tanner software

    Abstract: Currently, academics and researchers mostly use multiple individual software to create Silicon Photonics designs.Such a design process is inefficient, unable to scale,and error-prone. Just as the success of electronic integrated circuit relies on the mature electronic design automation (EDA) method, the Silicon Photonics design process mustbe further automated in order to address more complex and demanding design requirements.
    This course will introduce you the automated design methodologies for Silicon Photonics. From a practical point of view, we will show how to step-by-step realize your Silicon Photonics design using the IPKISS.eda integrated design frameworkprovided by Luceda Photonics (http://www.lucedaphotonics.com/) and Mentor Graphics (https://www.mentor.com/tannereda/), including layout, simulation, verification, and testing.
    There course sessions are mainly hands-on. You’ll use the IPKISS.eda, Tanner S-Edit and L-Edit software that are available on the PC room computer.
    If you have any questions, please contact lecturerRuping Cao. (mailto:ruping@lucedaphotonics.com).

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    Tao Chu 

    Zhejiang University

    Biography:

    储涛,教授,“千人计划”国家特聘专家。1991年毕业于四川大学,1991-1995年在中国电子科技集团公司第43研究所工作;1996-2003年在日本京都工艺纤维大学学习工作、获硕士(2001)和博士(2002)学位、2001-2003年任日本学术振兴会(JSPS)特别研究员,从事光电仪器研究;2003-2009年任日本光产业技术振兴协会(OITDA)研究员,2003-2007年兼任东京大学先端科学研究中心研究员,2006-2011年任日本电气株式会社(NEC)中央研究所硅基光子学研究部主任、主任研究员;2009-2011年任日本国家产业技术综合研究所(AIST)纳米器件中心主任研究员、总括主管。2010年入选中组部第5批千人计划(创新长期),2011-2016年在中国科学院半导体研究所工作,任中科院特聘研究员,中国科学院大学教授。2017年1月起任浙江大学信息与电子工程学院微电子学院教授。
    自2003年起从事光子晶体、硅基光电子器件和半导体光电集成技术研究,回国后成果包括:最快60Gb/s硅基电光调制器(2013)、性能最优AWG(2014)、最低插损EDG(2015)、最大规模硅基32x32高速电光开关阵列和64x64热光开关阵列(2016)等光子器件及模块。申请中美日专利约10项,发表论文80余篇,负责973、基金重点等国家项目和多项国内外企业合作项目研究。

    Title: 硅基光电子芯片集成技术发展与展望

    Abstract: 随着信息社会的进一步发展和大数据时代的到来,传统通信和电互连技术越来越难以满足数据传输与处理对于传输容量、通信速度、信号延迟、传输距离与电能消耗的要求,硅基光电子集成技术以前所未有的材料和技术优越性,为上述问题的解决提供了理想的途径,正在迅速发展,将逐渐成为构建现代信息社会关键硬件基础的主体技术。报告将结合本研究组十几年来针对光通信、光互连的最新研究内容、系统介绍光通信、光互连用硅基激光器、调制器、波分复用、模分复用、偏振控制、光开关、探测器等全系列硅基光子集成器件的研究思路、方法、成果和发展趋势,并讨论其在通信、互连、微波、传感等领域的应用可能性。

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    Junbo Feng

    China Electronics Technology Group Corporation

    Biography
     

    Junbo Feng received the B.E. and Ph.D. degrees from Huazhong University of Science and Technology, respectively. He studied in the electronic engineering department of Georgia Tech. during 2007.01~2008.06. After that, he continued his research in Peking University and Tsinghua University until 2011.He is currently a senior engineer in the 38th institute of China Electronics Technology Group Corporation. His research topics focus on silicon photonics and optical integration technologies. He has authored more than 30 journal and conference publications and a book chapter, owned more than 10 patents. He presided over 5 national and provincial projects in the past five years. He obtained Youth Talent Support Program and First Class Prizes of The State Scientific and Technological Progress Award in CETC38.

    Title: Fabrication and Packaging of Silicon Photonics-things to be considered in chip design

    Abstract: Silicon photonics is currently at the same early stage of development as microelectronics was in the 1970s. The designers must own some basic understanding of fabrication and packaging at the very beginning of scheme.The most attractive aspects of photonics on silicon arethe low primary cost of the material, the mature processing techniques, andthe potential for straightforward integration with electrical componentsin the same substrate. Even silicon photonics is always claimed to be CMOS compatible, every attempt to directly integrate photonic functionality into the advanced CMOSline so far, without making any process changes, has yielded poorly-performing devices or economic waste. Some special technologies (e.g. Ge on Si) are important in silicon photonics devices. Also, the large refractive index contrast of silicon photonics makes the coupling between silicon waveguide and outside world, for example single-mode fiber and semiconductor laser chip, a challenging work.In this coursethe state-of-the-art fabrication and packaging technologies and design rules of silicon photonics are introduced.

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    Hong Liu

    Google Technical Infrastructure

    Biography:

    Hong Liu is a Distinguished Engineer at Google Technical Infrastructure, where she is involved in the system architecture and optical solutions for datacenter, metro and access. Prior to joining Google, Hong was a Member of Technical Staff at Juniper Networks. Hong received her Ph.D in electrical engineering from Stanford University and , is an OSA Fellow.

    Title:: Evolving Requirements and Trends of Datacenter Networks - Opportunities and Challenges for Silicon Photonics

    Abstract: Google has built one of the world's largest compute infrastructures to support the evolving demands of interactive, storage and cloud services. In the past 15 years, the optical layer has evolved rapidly to connect servers, networking switches and routers. In this talk, we will present an overview of networking and optical interconnect requirements for large-scale datacenters. We then make a comparison between silicon photonics technologies and more traditional, commercial-off-the-shelf (COTS) options in meeting these requirements.

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    Baoqin Chen

    Institute of Microelectronics, CAS

    Biography:

    陈宝钦研究员,博士生导师,1942年生于福建省福州市,1966年毕业于北京大学物理系,1968-1985年任职于中国科学院半导体研究所,1986年至今于中国科学院微电子研究所。兼职中国科学院大学(国科大)教授;北京电子学会半导体专业委员会副主任、制版分会主任;全国半导体设备与材料标准化技术委员会副主任、微光刻分委会秘书长;全国纳米技术标准化技术委员会微纳加工技术工作组副秘书长,计量与测试技术工作组委员;中国科学院老科技工作者协会理事、微电子分会理事长、科学讲师团成员;创新创业iCAN讲师团成员;中国科学院大型仪器设备研发监理,中国科学院重庆绿色智能技术研究院学术委员会委员。
    多年来一直从事光掩模与先进掩模制造技术、电子束光刻技术、微光刻与微纳米加工技术研究和开发工作。在参加和合作开展的各项科研活动中获多项科技奖,分别于1979年至2013年间先后获国家科技进步奖二等奖两项和国家技术发明奖三等奖一项;航天科工集团、北京市和中国科学院科技进步奖一等奖五项、二等奖六项。2017年获中国科学院教育教学成果奖特等奖。由于在各项科研工作中做出了贡献被中共中央国家机关工作委员会授予优秀共产党员称号;国务院电子办授予全国电子信息先进工作者称号;中国科学院授予做出突出贡献研究员称号。先后为《中国大百科全书》、《现代高技术丛书》、《世界最新集成电路》、《半导体科学技术》、《集成电路工业全书》和中国科学院《高技术发展报告》撰稿人。受国家技术监督局委托负责主持起草并制定多项微光刻技术国家标准。先后发表专业论文百余篇。

    Title: 微光刻与电子束光刻技术的发展与展望

    Abstract: 半导体制造工艺是人类迄今为止最精细的加工工艺。要求:最完美的晶体、最精密的设备、最精确的工艺、最干净的材料、最洁净的环境、最敬业的人员。半导体制造工艺靠千百万材料工艺设备人员共同组成,任何一块短板决定整个国家的技术水平。挽救社会诚信,重建学术道德。只有全民族坚持诚信敬业、讲究质量、尊重工匠,中国微电子才有希望!在攀登科学高峰的道路上,没有捷径可走也没有平坦的大道,只有那些在不畏艰险地沿着崎岖而陡峭山路上攀登的人,才有可能到达光辉的顶点。投机取巧、弯道超车当心车毁人亡!

    1、 微光刻技术的发展历程。
    介绍光学光刻技术,光学光刻分辨率增强技术,光学光刻如何在短短的六十年中,微电子加工技术如神话般地突飞猛进地发展,一次又一次突破人们预测的加工分辨率极限,创造了人间奇迹。微光刻分辨率增强技术的发展历程就是技术不断创新的过程。
    2、电子束光刻技术。
    电子束光刻是实验室条件下,进行纳米加工技术在起到不可替代的作用。重点介绍电子束光刻极限在纳米CMOS集成电路研制和微纳米加工技术中的应用,电子束光刻工艺技术,电子抗蚀剂工艺技术,微纳加工数据处理技术。
    3、微电子技术的发展与展望。
    介绍集成电路制造业的发展历程,微纳米加工技术逼近工艺极限,微电子器件结构逼进物理极限及摩尔定律面临失效后,微电子技术去向何方?深化摩尔、拓展摩尔和超越摩尔。探讨中国集成电路产业和微电子技术如何才能突破包围圈。
    4、创造力和创新力的基础来自于学习力。
    提倡工匠精神,发挥自己的创意、创新、创造力的潜力。人的创造力和创新力来自三个方面:一是智商、二是勤奋、三是学习力,虽然勤奋很关键,但培养学习力比勤奋更重要。以魔方科学教具为例,体会提高学习力和学习方法的重要性。

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    Guanhui Wang

    Lumerical

     

    Biography:

    Guanhui Wang works at Lumerical Inc. as a support Engineer. She received the Master degree in electrical and computer engineering from McGill University, Montreal, QC, Canada in 2012. She has devoted herself helping the building of some Compact Model Libraries (CMLs) and supporting the development of the INTERCONNECT interoperability Electronic/Photonic Design Automation (EPDA) design environment.
    Title: Silicon Photonics Circuit Simulation

    Abstract: The application space for integrated photonics continues to expand into traditional electronics areas, and the push to transition from research towards commercial product development is intensifying. To support these trends, existing domain-specific design tools have to integrate with each other to provide the most efficient and least error prone design environment, enabling reliable analysis, optimization and design of both electronic and photonic circuits. Photonic Integrated Circuit (IC) presents physical and analytical challenges that require unique methods not used in traditional electronic IC design tools. These challenges need to be addressed to enable the designer of future complex photonic-electronic ICs with a schematic driven simulation and layout design flow.

    In this course, we will introduce the Electronic/Photonic Design Automation (EPDA)environment and study the EPDA workflow. The focus will be on the key part of the Process Design Kit (PDK) which is the Compact Model Library (CML).

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    Yikai Su

    Shanghai Jiaotong University

    Biography:

    Yikai Su received the Ph.D. degree in EE from Northwestern University, Evanston, IL, USA in 2001. He worked at Crawford Hill Laboratory of Bell Laboratories before he joined the Shanghai Jiao Tong University, Shanghai, China, as a Full Professor in 2004. His research areas cover silicon photonic devices for information transmission, processing and switching. He has over 400 publications in international journals and conferences, with more than 3600 citations (scopus search). He holds 6 US patents and ~50 Chinese patents. He is a Changjiang professor and the recipient of the NSFC distinguished young scientist award.

    Title: Silicon photonic devices for optical signal processing in wavelength, polarization and mode

    Abstract: In this lecture we will talk about recent progress on silicon photonic devices for optical signal processing, including nanobeam devices for wavelength filtering and switching, directional couplers for polarization processing, and subwavelength grating devices for mode processing.

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    Nan Qi

    Institute of Semiconductors, CAS

      

     

    Biography
     

    Nan Qi (祁楠) received the B.S. from Beijing Institute of Technology in 2005, M.S. and Ph.D. from the Institute of Microelectronics, Tsinghua University in 2008 and 2013, respectively.
    From 2010 to 2013 he led the GNSS group in Tsinghua University, building CMOS RF receivers for Beidou/GPS inter-operation. From 2013 to 2015, he worked as a research scholar inOregon State University, Corvallis, OR, on high-speed silicon photonic circuits. From 2015 to 2017, he worked as a post-doc and senior circuit-design engineer in Hewlett-Packard Labs, Palo Alto, CA, on CMOScircuits and E/O integration for silicon photonics. In 2017, he joined the Institute of Semiconductors, Chinese Academy of Sciences, as a ‘CAS 100-talent professor’. His interests include the design of mixed-signal circuits and systems, especially the high-speed transceiversfor optical communications.

    Title: High-speed Integrated Circuits for Silicon Photonics

    Abstract: Silicon photonics has been witnessed with an accelerated growth in the past several years, enablingthe large-scale integration of optical devices forhigher throughput. As most optical links start and end withelectricalinterfaces, high-speed integrated circuits play the key role in both O/E and E/O conversions, as well as the compensation for optical device non-idealities. This course focuses on the electrical circuits and systems, especially the CMOS transceiver for silicon photonic links.

    In this lecture, we start from the signal integrity and CMOS circuitfundamentals athigh-speed. Fundamental terms will be explained, such as bandwidth, jitter and signal reflection. After that, we will analyzecircuit details ofthe driver, TIA and equalizer, including the design considerationsoriginated fromsystem-level. Finally, we will discuss the advanced design techniques for silicon photonic transceivers. Some recent works will be reviewed, including our works on high-speed drivers and receivers.

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    Xingjun Wang

    Peking University

    Biography:

    Xingjun Wang received the B.E., M.E. and Ph.D. degrees from the Dalian University of Technology, China in 1999, 2002 and 2005, respectively. From 2005.4 to 2007.4, he was a postdoctoral researcher in Institute of Physics, Chinese Academy of Sciences. From 2007.4 to 2009.2, he was a JSPS postdoctoral follow in Department of Electronic Engineering, University of Electro-Communications, Japan. From 2009.1 up to now, he is afull Professor in School of Electronics Engineering and Computer Science, Peking University, China. In 2013, he was selected for New Century Excellent Talents Program of the Ministry of Education of China. In 2015, he was selected first Young Yangtse Rive Scholar of China. Now he is devoted into Si photonics, including the Si based light source and Si optoelectronic integration chip for high speed optical communication. Now he is devoted into Si photonics, including the Si based light source and Si optoelectronic integration chip for high speed optical communication. He has published more than 170 papers on international journals and conference proceedings. More than 80 papers have been SCI indexed. The citation reaches 1000 times.

    Title: Light emission and detection in Silicon Photonics

    Abstract: In this talk, we will focus on the basic theory of silicon emission and detection and recent progress about silicon based emission and detection devices. In the Si based light emission, firstly, we will introduce the universal theory of optical emission, and explain the reason that the laser can not be obtained. Then, from the material point of view, three methods to improve the Si luminescence efficiency are introduced: including low dimensional silicon, rare earth doping, direct band gap materials. On the basis of the above materials, three kinds of light-emitting diodes are introduced, such as bulk silicon light-emitting diode, nano silicon light-emitting diode, rare earth doped silicon and rare earth silicate luminescent diode. The latest progress of the latest Si based laser, including silicon Raman laser, III-V family silicon hybrid laser, and Ge silicon laser, is presented. In optical detection, first of all, we introduce the basic principle of photoelectric detector,then, we analysis the structure and properties of silicon based detector. Finally, we will focus on the two kinds of detector, bulk Si detector and Ge detector. In the aspect of Ge detector, the development of three kinds of waveguide Ge detector (PIN, APD and MSM) and the latest research results are presented.

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